Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate

Product Details
Customization: Available
Application: Structure Ceramic, Industrial Ceramic
Material: Alumina Ceramic
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  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
  • Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
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Overview

Basic Info.

Model NO.
SY-AIN
CAS
24304-00-5
Brand
Suoyi
Usage
Structure Ceramic
Color
White
Type
Ceramic Tubes
Transport Package
50kg/Drum, 10drums/Pallet
Specification
50KG
Trademark
SUOYI
Origin
Hebei, China
HS Code
2850001900
Production Capacity
2000ton/Month

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.500kg

Product Description

 
Detailed Photos

Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate

Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate
Aluminum Nitride Granulation Powder for Aluminum Nitride Substrate

Aluminum Nitride Granulation Powder for Aluminum Nitride SubstrateAluminum Nitride Granulation Powder for Aluminum Nitride Substrate

Aluminum Nitride, AIN Ceramic Properties

Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 20 years.

.Key Aluminum Nitride Properties

  Good dielectric properties
  High thermal conductivity
  Low thermal expansion coefficient, close to that of Silicon
  Non-reactive with normal semiconductor process chemicals and gases
.

Typical Aluminum Nitride Uses

  Substrates for electronic packages
  Heat sinks
  IC packages
  Power transistor bases
  Microwave device packages
  Material processing kiln furniture
  Semiconductor processing chamber fixtures and insulators
  Molten metal handling components

General Aluminum Nitride Information

Aluminum nitride has a hexagonal crystal structure and is a covalent bonded material. The use of sintering aids and hot pressing is required to produce a dense technical grade material. The material is stable to very high temperatures in inert atmospheres. In air, surface oxidation begins above 700°C. A layer of aluminum oxide forms which protects the material up to 1370°C. Above this temperature bulk oxidation occurs. Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C. The material dissolves slowly in mineral acids through grain boundary attack, and in strong alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Most current applications are in the electronics area where heat removal is important. This material is of interest as a non-toxic alternative to beryllia. Metallization methods are available to allow AlN to be used in place of alumina and BeO for many electronic applications.

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